Demonstration of a quick process to achieve buried heterostructure quantum cascade laser leading to high power and wall plug efficiency

Citation:

Wondwosen Metaferia, Bouzid Simozrag, Carl Junesand, Yan-Ting Sun, Mathieu Carras, Romain Blanchard, Federico Capasso, and Sebastian Lourdudoss. 2014. “Demonstration of a quick process to achieve buried heterostructure quantum cascade laser leading to high power and wall plug efficiency.” OPTICAL ENGINEERING, 53, 8, Pp. 087104. Publisher's Version

Abstract:

Together with the optimal basic design, buried heterostructure quantum cascade laser (BH-QCL) with semi-insulating regrowth offers a unique possibility to achieve an effective thermal dissipation and lateral single mode. We demonstrate here the realization of BH-QCLs with a single-step regrowth of highly resistive (>1 x 10(8) ohm . cm) semi-insulating InP:Fe in <45 min for the first time in a flexible hydride vapor phase epitaxy process for burying ridges etched down to 10 to 15 mu m depth, both with and without mask overhang. The fabricated BH-QCLs emitting at similar to 4.7 and similar to 5.5 mu m were characterized. 2-mm-long 5.5-mu m lasers with a ridge width of 17 to 22 mu m, regrown with mask overhang, exhibited no leakage current. Large width and high doping in the structure did not permit high current density for continuous wave (CW) operation. 5-mm-long 4.7-mu m BH-QCLs of ridge widths varying from 6 to 14 mu m regrown without mask overhang, besides being spatially monomode, TM00, exhibited wall plug efficiency (WPE) of similar to 8 to 9% with an output power of 1.5 to 2.5 W at room temperature and under CW operation. Thus, we demonstrate a quick, flexible, and single-step regrowth process with good planarization for realizing buried QCLs leading to monomode, high power, and high WPE. (C) The Authors. Published by SPIE under a Creative Commons Attribution 3.0 Unported License. Distribution or reproduction of this work in whole or in part requires full attribution of the original publication, including its DOI.
Last updated on 05/24/2020